
Next Generation Low Loss LCP Film
Next Generation Low Loss LCP Film
Next Generation Low Loss LCP Film
Next Generation Low Loss LCP Film
Next Generation Low Loss LCP Film
Next Generation Low Loss LCP Film
Next Generation Low Loss LCP Film
Low-Loss™ LCP FILM
The future runs on TCI’s Low-Loss™ LCP Film, driving performance in every high frequency 5G markets and beyond.
Designed for signal clarity in every connection, it powers next-generation devices, networks, and systems around the world.
Whether you're designing high-speed circuits, innovative high-frequency devices, or next-generation products.
TCI's LCP Film provides the advanced capabilities you need to take your creations to the forefront of the industry.
Experience the power of superior materials and unlock your design's full potential.
High Frequency 5G Target Markets

Consumer Electronics




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Unlock Next-Gen Connectivity and High-Performance Design with TCI's Liquid Crystal Polymer (LCP) Film

Low Moisture Absorption
With absorption rates below 0.05%, LCP Film ensures stability and reliability even in humid environments, preventing issues such as blistering, delamination, and corrosion. By maintaining consistent performance, it protects sensitive electronics and provides a superior substrate compared to polyimide in high-frequency circuits and complex electronic designs.

Electrical / Optical
LCP Film delivers exceptional electrical performance with a low dielectric constant (Dk) and low dissipation factor (Df), ensuring superior signal integrity at high frequencies. It provides excellent insulation while offering static charge dissipation for sensitive electronics and optical applications. This balance of electrical stability and optical clarity makes it ideal for advanced communication, sensor, and display technologies.

Thermal
With outstanding thermal resistance, LCP Film maintains stability in extreme temperature environments without warping or degradation. Its tailored coefficient of thermal expansion (CTE) aligns closely with metals, minimizing stress in bonded assemblies. Isotropic properties and low melt viscosity enhance processing precision, enabling consistent performance across demanding thermal cycles.

Chemical
Engineered for resilience, LCP Film offers broad-spectrum chemical resistance and ultra-low moisture absorption, ensuring long-term reliability in harsh conditions. Its low oxygen and carbon dioxide transmission rates make it effective for barrier applications. The inherent corrosion resistance protects components in chemically aggressive and high-humidity environments.

Mechanical
LCP Film combines high tensile strength and modulus with an impressive strength-to-weight ratio, delivering durability without adding mass. It exhibits superior adhesion to metals for strong, stable bonding in multilayer structures. Exceptional thermal dimensional stability ensures consistent mechanical performance, even under extreme heat and stress.

High-Performance Solutions for Advanced Electronics
Property | Unit | Method | Liquid Crystal Polymer Film (LCP) |
|---|---|---|---|
Dielectric Constant (Dk) @ 10 GHz | - | IPC-TM-650 2.5.5.15 | 3.30 |
Dissipation Factor (Df) @ 10 GHz | - | IPC-TM-650 2.5.5.15 | <0.0020 |
Peel Strength (RA & ED Cu Foils) | N/mm | IPC-TM-650 2.4.9 (90° Pull) | >1.0 |
CTE (x-y axis) | ppm/°C | IPC-TM-650 2.4.24.5 (TMA) | <18 |
Elastic Modulus | GPa | IPC-TM-650 2.4.19 | 5 |
Moisture Uptake | % | IPC-TM-650 2.6.2 | <0.05 |

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